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FPC

   FPC

 

No.

 

Item

Standard

Advanced

Comment

 

 

 

 

 

 

1

 

FCCL (adhesive)

Shengyi SF305:PI=0.5mil&1mil&2mil; Cu=0.33oz&0.5oz & 1oz

/

 

 

 

 

 

 

 

 

 

 

Panasonic R‐F775:PI=1mil&2mil&3mil; Cu= 0.5oz&1oz

PI=3mil; Cu=2oz

 

2

 

FCCL (adhesiveless)

 

 

 

 

Taiflex MHK: PI=1mil&2mil,Cu=0.33oz&0.5oz&1oz

 

 

 

 

 

 

 

 

 

 

 

DuPont Pyralux AP:PI=1mil,&2mil&3mil; Cu= 0.5oz &1oz

PI= 4mil; Cu=2oz

 

 

Material

 

 

 

 

3

Coverlay

Shengyi SF305C: 0515&0525&1025&2030

/

 

 

 

 

 

 

Taiflex FHK: 1025&2035

/

 

 

 

 

 

 

 

 

 

 

 

4

 

Adhesive

Taiflex BT: AD=10um, 25um and 40um

/

 

 

 

 

 

 

 

5

 

PI stiffener

Taiflex MHK: PI=3mil&5mil&7mil&9mil

/

 

 

 

 

 

 

 

6

 

3M

9077&6677&9058

/

 

 

 

 

 

 

 

7

 

Design software

CAM350&PROTEL&PADS&POWERPCB&AUTOCAD&GENESIS&ORCAD

/

 

 

 

 

 

 

 

8

 

Gerber format

RS‐274‐DRS‐274‐X

/

 

 

 

 

 

 

 

9

 

Drill format

EXCELLON format

/

 

 

 

 

 

 

 

10

 

Layer

1‐4

5‐8

 

 

 

 

 

 

 

11

 

Board thickness (without stiffener)

0.05‐0.5mm

0.5‐0.8mm

 

 

 

 

 

 

 

12

 

Tolerance of single layer

±0.05mm

±0.03mm

without stiffener

 

 

 

 

 

 

13

 

Tolerance of double‐layer(0.3mm)

±0.05mm

±0.03mm

without stiffener

14

 

Tolerance of multi‐layer(0.3mm)

±0.05mm

±0.03mm

without stiffener

15

 

Tolerance of multi‐layer(0.3mm‐0.8mm)

±0.1mm

±10%

without stiffener

 

 

 

 

 

 

16

 

Tolerance of board thickness(including PI stiffener)

±0.05mm

±10%

 

 

Others

 

 

 

 

17

Tolerance of board thickness(including FR4 stiffener)

±0.1mm

±10%

 

 

 

 

 

 

 

18

 

Min. board size

5*10mm(without birdge);10mm*10mm(with bridge)

4*8mm(withoutbirdge);8mm*8mm(with bridge)

 

 

 

 

 

 

 

19

 

Max. board size

9*14inch

9*23inch(PI≥1mil)

 

 

 

 

 

 

 

20

 

Impedance control tolerance

Single‐ended: ±5Ω(50Ω),±10%(>50Ω)

Single‐ended: ±3Ω(50Ω),±8%(>50Ω)

 

 

 

 

 

 

Differential: ±5Ω(50Ω),±10%(>50Ω)

Differential: ±4Ω(50Ω),±8%(>50Ω)

 

 

 

 

 

 

 

 

 

 

 

21

 

Min. coverlay bridge

8mil

/

 

 

 

 

 

 

 

22

 

Min. bend radius of single layer

3‐6 times of board thickness

/

 

 

 

 

 

 

 

23

 

Min. bend radius of double‐layer

6‐10 times of board thickness

/

 

 

 

 

 

 

 

24

 

Min. bend radius of multi‐layer

10‐15times of board thickness

/

 

 

 

 

 

 

 

25

 

Min. dynamic bend radius

20‐40 times of board thickness

/

single layer

 

 

 

 

 

 

26

 

Min. line width/spacing (12/18um copper)

3.0/3.2mil(loop lines 6.0/6.2mil )

2.8/2.7mil(loop lines 5/5.2mil)

 

 

 

 

 

 

 

27

Inner layer

Min. line width/spacing (35um copper)

4.0/4.0mil(loop lines 8.0/8.0mil)

3.5/3.5mil(loop lines 7/7mil)

 

 

 

 

 

 

28

Min. line width/spacing (70um copper)

6/6.5mil(loop lines 10/10.5mil)

5/6mil(loop lines 9/9.5mil)

 

 

 

 

 

 

 

 

 


29

 

Max. copper thickness

2oz

3oz

 

 

 

 

 

 

 

30

 

Min. line width/spacing (18um copper)

3/3.2mil(loop lines 6/6mil)

2.8/2.7mil(loop lines 5.5/5.5mil)

 

 

 

 

 

 

 

31

Outer

Min. line width/spacing (35um copper)

4/4.5mil(loop lines 8/8.5mil)

3.5/3.5mil(loop lines 7.5/7.5mil)

 

 

 

 

 

 

32

Min. line width/spacing (70um copper)

6/7mil(loop lines 10/11mil)

5.5/8.5mil(loop lines 9.5/10.0mil)

 

layer

 

 

 

 

 

 

33

Min. line width/spacing (105um copper)

10/13mil(loop lines 12/15mil)

9.5/12.5mil(loop lines 11.5/14.5mil)

 

 

 

 

 

 

 

 

 

34

 

Max. finished copper thickness

3oz

5oz

 

 

 

 

 

 

 

 

 

 

6mil (<4 layer)

5mil (<4 layer)

 

35

 

Min. distance between via and conductors

 

 

 

Drilling

8mil (4~6 layer )

7mil (4~6 layer )

 

 

 

 

 

 

 

 

12mil (7‐8 layer )

10mil (7‐8 layer )

 

 

 

 

 

 

 

 

 

 

 

36

 

Min. mechanical drill hole

6mil

4mil

 

 

 

 

 

 

 

37

Solder

Solder mask color

green

/

 

 

 

 

 

 

38

Min. solder dam (base copper 1oz)

4mil(green), 8.0mil(solder dam on the large copper)

/

 

mask and

 

 

 

 

 

 

39

Min. clearance

3mil(part for 2.5mil)

/

 

silk screen

 

40

Silk color

white, yellow

/

 

 

 

 

 

 

 

 

 

41

 

Surface treatment

HASL ,ENIG, ENEPIG, Electrolytic Nickel Gold, Soft gold, Hard gold,

Immersion tin

 

 

Immersion silver and OSP

 

 

 

 

 

 

42

 

Mixed surface treatment

ENIG+OSP,ENIG+G/F

/

 

 

 

 

 

 

 

43

 

Gold thickness (ENIG)

0.05‐0.10um

/

 

 

 

 

 

 

 

44

 

Nickel thickness (ENIG)

3‐6um

/

 

 

 

 

 

 

 

45

 

Gold thickness (ENEPIG)

0.05‐0.10um

/

 

 

Surface

 

 

 

 

46

Palladium thickness (ENEPIG)

0.05‐0.15um

/

 

treatment

 

 

 

 

 

 

47

Nickel thickness (ENEPIG)

3‐6um

/

 

 

 

 

 

 

 

48

 

Electrolytic Nickel thickness

3‐6um

/

 

 

 

 

 

 

 

49

 

Electrolytic Gold thickness

0.05‐0.10um

/

 

 

 

 

 

 

 

50

 

Hard gold thickness(including lead)

0.1‐1.5um

/

 

 

 

 

 

 

 

51

 

OSP thickness

0.1‐0.3um

/

 

 

 

 

 

 

 

52

 

Immersion silver thickness

0.2‐0.4um

/

 

 

 

 

 

 

 

53

Routing

Laser accuracy

±0.05mm

/

 

 

 

 

 

 

54

Punch accuracy

±0.05mm ‐ ±0.15mm

/

 

 

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